Methods and apparatus for a grounding gasket
US8197285B2 · kind B2 · utility
42Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Aug 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/927
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive gasket includes a deformable contact region configured to provide compressive contact between the mounting surface of a connector (e.g., a right-angle micro-D connector) and a grounded surface of the substrate (e.g., PCB). A fastener region extends from the deformable contact region and is configured to align with a mounting region of the connector. A keep-out zone is provided adjacent to the deformable contact region and the fastener region and is configured to allow the pins of the connector to pass therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.