Seam joining together at least two web materials
US8197458B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2006 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Aug 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A seam joining together at least two web materials in an overlapped manner, wherein the overlapped portions are bonded together by ultrasonic welding, heat bonding, laser welding or the like, in a bonding pattern extending over at least a part of the overlapped portion to form said seam. The bonding pattern has a main bonding pattern extending in longitudinal direction along at least a part of the overlapped portion, and at least one edge bonding pattern extending in longitudinal direction along at least a part of along and adjacent at least one side edge of the overlapped portion, the bonded area of said edge bonding pattern occupying no more than 30% of the total bonded area of the central bonding pattern plus the bonded area of the edge bonding pattern. The seam may be present in a personal care absorbent article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.