Hard laminated film, method of manufacturing the same and film-forming device
US8197647B2 · kind B2 · utility
0Cited by
16References
13Claims
0Family size
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Key dates
| Filing date | May 31, 2007 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Dec 6, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hard laminated Mm wherein a layer A and a layer B having specific compositions are deposited alternately so that the compositions of layer A and layer B are different. The thickness of layer A per layer is twice or more the thickness of layer B per layer, the thickness of layer B per layer is 5 nm or more, and the thickness of layer A per layer is 200 nm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.