Patent · US Active

Thermoplastic moulding compositions having improved ductility

US8197715B2 · kind B2 · utility

8Cited by

11References

18Claims

0Family size

Assignee

BASE SE · DE

Inventors

Martin Weber · Maikammer, DE
Xaver Hopfenspirger · Nümbrecht, DE
Steffen Funkhauser · Viernheim, DE
Walter Heckmann · Weinheim, DE
Jörg Schnorr · Ludwigshafen, DE
Raquel Fernandez Rodiles · Mannheim, DE
Rainer Klenz · Herbrechtingen, DE
Hagen Stawitzki · Karlsruhe, DE
Bernd Bruchmann · Ludwigshafen, DE

Key dates

Filing date	Dec 11, 2007
Grant date	Jun 12, 2012
Priority date	—
Expiry date	Feb 18, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/03
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.