Fabrication method for thermoelectric device

US8198116B2 · kind B2 · utility

Assignees

• CORNING INCORPORATED · US
• Shanghai Institute of Ceramics · CN

Inventors

• Lidong Chen · Shanghai, CN
• Monika Backhaus-Ricoult · Horseheads, US
• Lin He · Irvine, US
• Xiaoya Li · Tianjin, CN
• Xugui Xia · Shanghai, CN
• Degang Zhao · Weifang, CN

Key dates

• Filing date: Dec 22, 2009
• Grant date: Jun 12, 2012
• Expiry date: Oct 14, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N10/01

Abstract

A method for fabricating thermoelectric device is provided. The method comprises placing a first electrode in a die, forming a first interlayer on an upper surface of the first electrode; positioning a separating plate on an upper surface of the first interlayer to divide an inner space of the die into a plurality of cells, and depositing a first thermoelectric material on the first interlayer within a first fraction of the cells, and depositing a second thermoelectric material on the first interlayer within a second fraction of the cells, sintering the die contents, and removing the separating plate after sintering to obtain a π shaped thermoelectric device.