Method for producing flexible integrated circuits which may be provided contiguously

US8198135B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Gerhard Klink · Munich, DE
• Christof Landesberger · Gräfelfing, DE
• Michael Feil · Munich, DE

Key dates

• Filing date: Nov 10, 2010
• Grant date: Jun 12, 2012
• Expiry date: Nov 10, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49117
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.