Method of preparing low resistance metal line, patterned metal line structure, and display device using the same
US8198191B2 · kind B2 · utility
2Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2010 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.