Electrostatic chuck and substrate temperature adjusting-fixing device
US8199454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electrostatic chuck for placing an adsorption object or a base body having an electrostatic electrode embedded therein and generating a coulombic force between the adsorption object and the electrostatic electrode by applying a voltage to the electrostatic electrode so as to hold the adsorption object in an adsorption state, wherein the base body includes a upper surface of the base body opposed to the adsorption object and a protrusion portion provided in the upper surface of the base body so as to come into contact with the adsorption object, and wherein the protrusion portion is provided in a region except for an outer edge portion of the upper surface of the base body, and the outer edge portion is substantially formed in the same plane as that of the upper surface of the base body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.