Heat dissipating device
US8199502B2 · kind B2 · utility
3Cited by
3References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2010 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.