Patent · US Active

Transport housing for an electronic flat module

US8199525B2 · kind B2 · utility

2Cited by

9References

18Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Peter Bohnen · Berlin, DE
Philip Mihailovic · Berlin, DE

Key dates

Filing date	Aug 23, 2007
Grant date	Jun 12, 2012
Priority date	—
Expiry date	Feb 12, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH05K5/15
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A transport housing for receiving an electronic flat assembly, the electronic assembly having at least one controllable electronic component in the form of a DIP switch and a connecting line, has two housing halves receiving the flat assembly, wherein the one housing half is inserted at least partially into the other housing half, and wherein the two housing halves have a plurality of molded elements that are disposed in a staggered arrangement, for creating a molded lock having two detent positions successively disposed in the locking direction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.