Microphone arrangement and method for production thereof
US8199963B2 · kind B2 · utility
3Cited by
9References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Mar 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone arrangement comprises a stack arrangement (1) which comprises a first semiconductor body (10) having a microphone structure (13) and a second semiconductor body (80). The second semiconductor body (80) comprises a first main face (81) on which an integrated circuit (83) is arranged and a second main face (82) which faces the first semiconductor body (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.