Patent · US Active

Method for inspecting a surface of a wafer with regions of different detection sensitivity

US8200004B2 · kind B2 · utility

8Cited by

8References

19Claims

0Family size

Assignee

Vistec Semiconductor Systems GmbH · DE

Inventors

Detlef Michelsson · Aßlar, DE
Joerg Richter · Ludwigsburg, DE

Key dates

Filing date	Dec 9, 2008
Grant date	Jun 12, 2012
Priority date	—
Expiry date	Aug 13, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/9503
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.