Nanoimprint resist, nanoimprint mold and nanoimprint lithography
US8202468B2 · kind B2 · utility
14Cited by
3References
14Claims
0Family size
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Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Sep 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A nanoimprint mold includes a flexible body and a molding layer formed on the flexible body. The molding layer includes a plurality of protrusions and recesses. The molding layer is a polymer material polymerized via a cross linking polymerization of a nanoimprint resist which includes a hyperbranched polyurethane oligomer (HP), a perfluoropolyether (PFPE), a methylmethacrylate (MMA), a diluent solvent and a photo initiator. A method for making the nanoimprint mold is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.