Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines
US8202566B2 · kind B2 · utility
6Cited by
19References
5Claims
0Family size
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Key dates
| Filing date | Oct 3, 2005 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Sep 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.