Method of forming metal film
US8202576B2 · kind B2 · utility
1Cited by
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11Claims
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Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Oct 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/185
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.