Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer
US8202920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2007 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | May 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.