Integration of SMD components in an IC housing

US8203168B2 · kind B2 · utility

Assignee

• Micronas GmbH · DE

Inventors

• Felix Schinner · Emmendingen, DE
• Christian Joos · Ehrenkirchen, DE
• Wolfgang Hauser · Blankenloch, DE
• Michael Schmidt · Holden, US
• Thomas Burke · Glückstadt, DE

Key dates

• Filing date: Sep 22, 2010
• Grant date: Jun 19, 2012
• Expiry date: Feb 22, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.