Diode leadframe for solar module assembly
US8203200B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2009 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Mar 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe design for a diode or other semiconductor device that reduces stress on the device and provides increased heat dissipation is provided. According to various embodiments, the leadframe has a contoured profile including a recessed area and a raised surface within the recessed area. The surface supports the device such that the edges of the device extend past the surface. Also provided are device assemblies including the novel leadframes. In certain embodiments, the assemblies include one or more leadframes attached via a solder joint to a device. According to various embodiments, the leadframes are attached to the front side of the device, back side of the device or both. In particular embodiments, the device is a bypass diode for one or more solar cells in a solar module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.