Method of manufacturing head gimbal assembly
US8205323B2 · kind B2 · utility
2Cited by
3References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Nov 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.