Apparatus for attaching substrates
US8205653B2 · kind B2 · utility
3Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2008 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Sep 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.