Method and structure for forming a gyroscope and accelerometer
US8207004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Sep 25, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.