Printed circuit board comprising metal bumps integrated with connection pads
US8207450B2 · kind B2 · utility
8Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | May 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.