Light emitting diode package and method for manufacturing same
US8207549B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2010 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | May 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.