Dimple forming apparatus and dimple forming method
US8208223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Sep 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mold with a concave surface, a heating unit and a forming pin with a spherical surface. The base mold is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.