System, apparatus and method for cooling electronic components
US8208259B1 · kind B1 · utility
2Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2010 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.