Protocol circuit layer
US8208466B2 · kind B2 · utility
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8Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 1, 2007 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L45/74
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A protocol circuit layer is described. The protocol circuit layer may employ a routing layer to determine optimal routes when establishing a circuit. The circuit layer may employ a link layer to send data packets over links to other network nodes. A naming layer may employ circuits to establish a distributed database of associations between network node addresses and their network locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.