Semiconductor laser device and heat sink used therein
US8208510B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2006 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Apr 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser device has a heat sink of which multiple laminated plates are constituted and a semiconductor laser element mounted on upper surface of the heat sink. The heat sink has a channel in which a coolant flows inside thereof. The heat sink includes a channel-forming plate portion that forms the channel and a mounting plate portion that forms an upper surface of the heat sink that comes into contact with the channel. The mounting plate portion is made of material having a thermal expansion coefficient, which is closer to that of the semiconductor laser element than that of the channel-forming plate portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.