Method for manufacturing a touch screen sensor assembly
US8209861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2009 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Oct 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a touch screen sensor assembly that includes providing a first transparent substrate, depositing a first non-metallic conductive layer onto the first substrate, removing the first conductive layer from a viewing portion of the first substrate, depositing a second non-metallic conductive layer onto the viewing portion, and removing portions of the second and first conductive layers to respectively form a first electrode pattern and a plurality of traces. The disclosed method also includes providing a second transparent substrate, depositing a third non-metallic conductive layer onto a viewing portion of the second substrate, removing portions of the third conductive layer to form a second electrode pattern, and bonding the first substrate to the second substrate using an optically clear adhesive. Each trace on the first substrate formed from the first conductive layer is electrically coupled to at least one electrode of either the first or second electrode patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.