Patent · US Active

Sensor module with a housing which may be mounted on a wall

US8210037B2 · kind B2 · utility

6Cited by
2References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 16, 2007
Grant dateJul 3, 2012
Priority date
Expiry dateJun 21, 2029

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01D11/30
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A sensor module has a housing that may be mounted about a through opening of an assembly surface. The housing extends at least partly through the through opening when the housing is disposed on the assembly surface. The sensor module further has a sealing body, between the outer surface of the housing and the through opening of the assembly surface and an attachment device, by way of which the housing is fixed to the assembly surface. The attachment device lies on the through opening in order to bring about a mechanical fixation of the housing to the assembly surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.