Sensor module with a housing which may be mounted on a wall
US8210037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2007 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jun 21, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D11/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor module has a housing that may be mounted about a through opening of an assembly surface. The housing extends at least partly through the through opening when the housing is disposed on the assembly surface. The sensor module further has a sealing body, between the outer surface of the housing and the through opening of the assembly surface and an attachment device, by way of which the housing is fixed to the assembly surface. The attachment device lies on the through opening in order to bring about a mechanical fixation of the housing to the assembly surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.