Patent · US Active

Low application temperature hot melt adhesive composition and articles including the same

US8211521B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

H.B. Fuller Company · US

Inventors

Beth M. Eichler-Johnson · Windom, US
Vitaly Rogachevsky · Woodbury, US

Key dates

Filing date	Nov 13, 2008
Grant date	Jul 3, 2012
Priority date	—
Expiry date	Aug 24, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1419
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.