Patent · US Active

Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding

US8211556B2 · kind B2 · utility

1Cited by

5References

37Claims

0Family size

Assignees

SGL CARBON SE · DE
Saint-Gobain Rigips GmbH · DE

Inventors

Werner Guckert · Adenau, DE
Winfried Spickermann · Bodenwerder, DE
Heinz-Joachim Butz · Bodenwerder, DE
Stephan Duckwitz · Bodenwerder, DE
Dieter Ehlting · Bocholt, DE

Key dates

Filing date	Aug 4, 2006
Grant date	Jul 3, 2012
Priority date	—
Expiry date	Dec 13, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/30
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A gypsum-based building material having increased thermal conductivity and shielding attenuation, a method for producing the building material, a molding containing the building material and a method for producing the molding are provided. The products and methods include adding ground stock formed of compacted expanded graphite to gypsum-based building materials in order to increase the thermal conductivity and the electromagnetic shielding attenuation of the building materials and moldings, for example gypsum cardboards, produced therefrom.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.