Patent · US Active

Filled polyamide molding materials

US8211962B2 · kind B2 · utility

1Cited by
0References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 12, 2008
Grant dateJul 3, 2012
Priority date
Expiry dateNov 12, 2028

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/02
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Filled polyamide molding compounds which, in addition to a selected polymer mixture comprising polyamides and a flameproofing agent, contain glass fibers with non-circular cross-sections, the use of such molding compounds for the production of molded articles, and the molded articles themselves.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.