Filled polyamide molding materials
US8211962B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2008 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Nov 12, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Filled polyamide molding compounds which, in addition to a selected polymer mixture comprising polyamides and a flameproofing agent, contain glass fibers with non-circular cross-sections, the use of such molding compounds for the production of molded articles, and the molded articles themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.