Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device
US8211993B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 2006 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jun 20, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C2222/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.