Printed wiring board and manufacturing method thereof
US8212365B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jan 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board is configured to be connected to an organic substrate in a state where a semiconductor chip is mounted thereon. A plurality of first layers are formed of a material having the same coefficient of thermal expansion as the semiconductor chip. A plurality of second layers are formed of a material having the same coefficient of thermal expansion as the organic substrate. The first layers have different thicknesses from each other and the second layers have different thicknesses from each other. The first layers and the second layers form a lamination by being laminated alternately one on another. The thicknesses of the first layers decrease from a side where the semiconductor chip is mounted toward a side where the organic substrate is connected. The thicknesses of the second layers decrease from the side where the organic substrate is connected toward the side where the semiconductor chip is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.