Thermal head, manufacturing method therefor, and printer
US8212849B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 10, 2010 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Mar 5, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression: Ra≦loge(T2)/(3×106)+6.5×10−6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.