Thin disk laser operations with unique thermal management
US8213471B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 24, 2011 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jan 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0604
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thermal management apparatus and method for a thin disk laser system enabling the laser system to have near isothermal temperatures across and throughout a thin disk comprising a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K that promotes near isothermal conditions in lasing of the thin disk, a thin disk lasing crystal or ceramic bonded to the mechanically controlled oscillating heat pipe, and a supporting structure including a surface bonded to the thin disk that matches the CTE (coefficient of thermal expansion) of both materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.