Bone conduction assembly for communication headsets
US8213645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2009 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Nov 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bone conduction assembly can include at least a microphone, an assembly stem, an ear cushion, and a microphone channel. The microphone can include an acoustic-to-electric transducer. The assembly stem can house the microphone and can be shaped for insertion into an ear canal of a user. The ear cushion can have an inner surface surrounding an outer surface of the assembly stem and an outer, contiguous, annular surface configured to maintain contact with an ear canal of a user when worn. The microphone channel can be shaped to channel vibrations resulting from bone conduction from the ear canal through the assembly stem to the microphone. In one embodiment, the bone conduction assembly can include a speaker having a speaker channel that is acoustically isolated from the microphone channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.