Electronic-integration compatible photonic integrated circuit and method for fabricating electronic-integration compatible photonic integrated circuit
US8213751B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2009 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Dec 2, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/035
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic-integration compatible photonic integrated circuit (EIC-PIC) for achieving high-performance computing and signal processing is provided. The electronic-integration compatible photonic integrated circuit comprises a plurality of electronic circuit structures and a plurality of photonic circuit structures. The electronic and photonic circuit structures are integrated by a process referred to as monolithic integration. An electronic circuit structure includes one or more electronic devices and a photonic circuit structure includes one or more photonic devices. The integration steps of electronic and photonic devices are further inserted into standard CMOS process. The photonic circuit structures and the electronic circuit structures are integrated to form the electronic-integration compatible photonic integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.