Lead implant system

US8214045B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Christine G. Kronich · Windom, US
• John L. Sommer · Coon Rapids, US
• William K. Wenger · Weehawken, US
• Michael D. Eggen · Chisago City, US
• Gerald Jordan Montgomery · Blaine, US
• Joseph A. DuPay · Andover, US

Key dates

• Filing date: Apr 30, 2008
• Grant date: Jul 3, 2012
• Expiry date: May 4, 2031

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N2001/37294
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A lead implant system includes a lead coupling device, which is configured to couple a lead during an implant procedure, in communication with a medical device and an implantable medical device, which is contained within a package that includes an electrical interface for electrical coupling with an electrical contact of the implantable medical device. The electrical interface facilitates coupling of the packaged medical device to an electrical contact of another medical device, which is located outside the package. If the electrical contact of the packaged device is mounted within a bore of the device, then the connector structure allows for passage of a sterilizing gas into the connector bore, and past the connector contact, within the bore.