Process for producing piezoelectric ceramic devices
US8214983B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Nov 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
Abstract
An improved process for producing a piezoelectric ceramic device is disclosed, wherein the process includes the following steps: securing a metal plate in a mold cavity body by maintaining a binding area on a top surface of the metal plate, and that the top surface other than the binding area is enveloped, confined and secured; coating a metal paste on the binding area; placing a piezoelectric ceramic powder on the metal paste; pressing a pressing pillar on the piezoelectric ceramic powder; securing the pressing pillar in position; heating the mold cavity body so as to sinter the piezoelectric ceramic powder as a sintered body, and heating the mold cavity body so as to treat the sintered body to become a not-yet polarized piezoelectric ceramic sheet. Therefore, the same mold is employed for the piezoelectric ceramic powder sintering, the heat treatment, and the positioning and binding to the metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.