Interposer connector assembly
US8215966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2010 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Oct 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interposer connector assembly includes a substrate, conductive pads, and contacts. The substrate has opposite first and second sides with a conductive via extending through the substrate. The conductive pads are mounted to the first and second sides of the substrate and electrically coupled with each other by the via. The contacts are electrically joined with the conductive pads on the first and second sides of the substrate. The contacts protrude from the substrate to outer ends that are configured to engage conductive members of electronic packages that mate with the first and second sides of the substrate. A differential electrical impedance characteristic of a conductive pathway extending from the outer end of one of the contacts to the outer end of another one of the contacts is at least 65 Ohms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.