MEMS vascular sensor
US8216434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2008 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Feb 5, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N3/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.