Method for manufacturing printed circuit board using imprinting
US8216503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2007 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Nov 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.