Structured resin systems with high thermal conductivity fillers
US8216672B2 · kind B2 · utility
5Cited by
67References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 14, 2005 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Apr 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.