Method for manufacturing array board for display device
US8216762B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 1, 2006 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/80
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An array for a display device is formed by adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate. The supporting film is then released from the photoresist resin layer adhered to the surface of the substrate, the layer is exposed to light; and the positive type photoresist layer is developed to remove exposed regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.