Taphole fill material and method for manufacturing the same
US8216954B2 · kind B2 · utility
2Cited by
23References
20Claims
0Family size
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Key dates
| Filing date | Nov 3, 2011 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.