Apparatus and method for embedding components in small-form-factor, system-on-packages
US8217272B2 · kind B2 · utility
7Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2009 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | May 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.