Reducing back-reflections in laser processing systems
US8217302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2008 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | May 11, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/046
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods reduce or prevent back-reflections in a laser processing system. A laser processing system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface, and a lens to receive the incident laser beam along a first axis of propagation that is substantially perpendicular to the work surface. The lens includes a primary axis that is substantially parallel to, and offset from, the first axis of propagation. The lens is configured to focus the incident laser beam onto the work surface along a second axis of propagation that forms a non-perpendicular angle with the work surface such that at least a substantial portion of a reflected laser beam from the work surface does not return to the laser beam output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.