Thermal interface device
US8217512B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Sep 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface device (100) includes a base member (102) and a pocket (104) which is filled with a thermally conductive material or medium such as diamond dust suspended in a solvent such as propylene glycol or a thermally conductive material such as thermally conductive rubber. The pocket (104) is hermitically sealed to the base member (102) in order to keep the thermally conductive material within the pocket. The filled pocket (104) forms a deformable “pillow” having a high thermal conductance. The deformable pocket (104) can contour to the shape of a device it is pressed against such as an electronic device undergoing testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.