System for performing bonding a first substrate to a second substrate
US8220140B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2010 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Sep 13, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for performing bonding of a first substrate including a first plurality of solder pads to a second substrate including a second plurality of solder pads comprises a first alignment mark set and a first plurality of dots on the first substrate. The system further comprises a second alignment mark set and a second plurality of dots on the second substrate. The second plurality of dots are configured to interlock and form an interlocking key with the first plurality of dots. The first alignment mark set is aligned with the second alignment mark set corresponding to the first and second plurality of dots being aligned and the first and second plurality of solder pads being aligned. The first and second plurality of dots are configured to remain substantially solid during a reflow of the first plurality of solder pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.